On June 18, Silan Microelectronics began construction of its major project in Haicang: the 8-inch silicon carbide power device chip manufacturing production line. With a total investment of 12 billion yuan, the project will be constructed in two phases. Once completed, it will have an annual production capacity of 720,000 8-inch silicon carbide power device chips. This project will significantly enhance Silan Microelectronics' silicon carbide chip manufacturing capabilities, meeting the domestic demand for these chips in electric vehicles and providing high-performance silicon carbide chips for photovoltaic, energy storage, and charging pile power inverter products. Silan Microelectronics is one of China's leading integrated semiconductor design and manufacturing enterprises, specializing in the design, manufacturing, and packaging of silicon and compound semiconductor products, with strong capabilities and advanced technology. The commencement of this project will accelerate the development of Xiamen's third-generation semiconductor industry, providing strong support for the city's industrial transformation and upgrading, and developing new productive forces. In recent years, Xiamen has been accelerating the construction of a "4+4+6" modern industrial system, continuously strengthening the electronic information industry as one of the four pillar industries, and prioritizing the third-generation semiconductor industry as one of the six future industries.
